外伴管伴热系统传热特性及优化的数值研究

利用FLUEM软件,对外伴管伴热体系传热特性及其优化进行了数值分析与讨论.分析表明系统中存在传导、对流及辐射传热,其中封闭空气夹层又存在层流自然对流.计入空气对流的模拟表明,工艺管受热不均匀,而伴管布置在其正下方、保持空气层不被保温层挤占可提高伴热效果.伴热平衡时,伴热介质温度、热损失随物料温度近似线性增加.空气层均温假设导致工程设计不合理,而降低工艺管与伴管之间的热阻是提高伴热能力的关键.     

炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

HSDPA的引入策略

首先简述HSDPA承载业务的定位．然后重点从引入方式、组网方式、码资源和功率资源的分配策略等方面分析了HSDPA的引入策略。     

连续波腔衰荡技术原理推导及实验研究

基于无源腔的Q值定义,根据能量守恒原理,对连续波腔衰荡技术测量原理进行了推导,并基于多光束干涉理论,就入射光关断时间对腔出射光强信号衰荡线形及测量结果的影响进行了数值模拟和分析,分析表明：入射光的关断时间很大程度上决定着腔出射光功率信号的衰减线形,如果要消除入射光关断时间对测量结果的影响,入射光关断必须小于腔衰荡时间的1%。根据理论分析要求建立了一套测量系统,并对腔损耗约为50ppm的低损无源腔进行了实际测量,实验结果的分析显示,该测量系统测量误差约为0．15ppm。     

一种平面结构的V波段上变频器

介绍了平面结构的V波段变频器，该变频器采用平衡变频结构，变频电路主体为平面结构，同时采用了E面探针结构的波导微带转换作为射频信号输出，文中给出了该上变频器的电路软件仿真结果和实测结果以及E面探针波导微带转换的仿真和测试结果，最后给出了该上变频器的实物结构。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Thermomechanical finite-element model of shell behavior in continuous casting of steel

A coupled finite-element model, CON2D, has been developed to simulate temperature, stress, and shape development during the continuous casting of steel, both in and below the mold. The model simulates a transverse section of the strand in generalized plane strain as it moves down at the casting speed. It includes the effects of heat conduction, solidification, nonuniform superheat dissipation due to turbulent fluid flow, mutual dependence of the heat transfer and shrinkage on the size of the interfacial gap, the taper of the mold wall, and the thermal distortion of the mold. The stress model features an elastic-viscoplastic creep constitutive equation that accounts for the different responses of the liquid, semisolid, delta-ferrite, and austenite phases. Functions depending on temperature and composition are employed for properties such as thermal linear expansion. A contact algorithm is used to prevent penetration of the shell into the mold wall due to the internal liquid pressure. An efficient two-step algorithm is used to integrate these highly nonlinear equations. The model is validated with an analytical solution for both temperature and stress in a solidifying slab. It is applied to simulate continuous casting of a 120 mm billet and compares favorably with plant measurements of mold wall temperature, total heat removal, and shell thickness, including thinning of the corner. The model is ready to investigate issues in continuous casting such as mold taper optimization, minimum shell thickness to avoid breakouts, and maximum casting speed to avoid hot-tear crack formation due to submold bulging.     

Glycoconjugated polymer 6. Synthesis of poly[styrene-<Emphasis Type="Italic">block</Emphasis>-(styrene-<Emphasis Type="Italic">graft</Emphasis>-amylose)] via potato phosphorylase-catalyzed polymerization

Summary The potato phosphorylase-catalyzed polymerization of α-D-glucose-1-phosphate (G-1-P) onto poly[styrene-block-(4-vinylbenzyl maltohexaoside)] (1) was performed at the molar ratios of [G-l-P]₀ and [maltohexaose]₀ of 35, 80, and 250. The product was found to be soluble in dimethyl sulfoxide, which was a good solvent for amylose, and showed the complex-formation with iodine, indicating that the product was assignable to poly[styrene-block-(styrene-graft-amylose)] (2). The quantitative analysis of the liberated phosphoric acid gave the average degree of polymerization o f the glucose unit (n) as 27, 5 1, and 180 for 2-I, 2-II, and 2-III, respectively. Received: 29 November 2002/Accepted: 22 December 2002 Correspondence to Toyoji Kakuchi